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- NEC's R&D
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- Jisso Platform Technologies
- High-Precision Vibration Sensor Solution
- Silicon Photonics
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Silicon Photonics
Photonic device integration is indispensable for preparing more energy-efficient IT and network equipments handling a large amount of data required in the future society. As a promising technology for photonic device integration, silicon photonics has attracted much attention. Based on the same fabrication process as that intensively developed for large-scale integrated circuits (LSI), silicon photonics provides ultra-small photonic devices and their large-scale integration.
Using silicon photonics, NEC is developing a compact and low driving power optical switch. Its chip footprint is about 100 times smaller and its driving power is about 10 times lower compared to conventional approaches. Toward real application of this optical switch, many requirements such as low loss, high on-off ratio, polarization independence, and ambient temperature insensitiveness should be achieved simultaneously. By establishing the design of element devices and integrated circuits, NEC has developed a new optical switch chip where over 150 thermo-optical switch elements are integrated within an area of 12 mm x 16 mm. This switch chip is not only compact and low power but also has shown for the first time the above various properties required for application. The development of packaging technology including low loss optical coupling is in progress.
In the future, such silicon photonics devices will be applied to IT and network equipments supporting C&C cloud infrastructure handling a large amounts of data.
Ultra-sensitive vibration sensor
