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- NEC's R&D
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- Jisso Platform Technologies
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Jisso Platform Technologies
ICT continues to have drastic impacts on our society. More and more devices become part of the network, and the complex social systems require the technology that makes them safe and reliable.
Electronic products include servers, communication systems, PCs, smart phones and POS systems. The Jisso technologies enable the transfer of power and signals among semiconductor chips inside these systems, semiconductor packages and printed wiring boards (PWBs). Jisso technologies are the key to maximize the performance of ever-evolving electronic products.
For high speed and low power semiconductor chips to perform better, signal integrity, power integrity and electromagnetic compatibility must be considered. For wireless devices, the quality of wireless communications is part of the design. Heat generated by the chips also needs to be managed. These issues are interrelated possibly causing design conflicts, and the design process is therefore complex and time-consuming.
We conduct research on the management of electromagnetic fields based on our platform technology using metamaterials, or artificially engineered materials. A recent development includes one of world’s smallest antenna that may be suitable for wireless modules using an EBG structure that effectively reduces electromagnetic noise through PWBs.
In our view, the issue of dissipated heat is an opportunity to improve the cooling effectiveness and the energy efficiency with a goal to manage energy usage for the entire system. Jet impingement cooling has been used in our products and is an example of highly efficient cooling technology. We currently conduct research and development on phase change cooling technology that has a high heat transfer potential.
Our goal is to contribute to NEC’s new businesses of cloud service and to augment the competitiveness of our hardware devices.
